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ESD11A3.3DT5G SERIES Transient Voltage Suppressors
ESD Protection Diodes in Ultra Small SOT-1123 Package
The ESD11A Series is designed to protect voltage sensitive components from damage due to ESD. These parts provide excellent ESD clamping capability and fast response time to enhance the immunity of the end application from system level ESD stress such as IEC61000-4-2. Two uni-directional TVS diodes are housed in the ultra small SOT-1123 package, making these parts ideal for ESD protection on designs where board space is at a premium, such as cell phones, MP3 players and many other portable handheld electronic devices.
Specification Features: http://onsemi.com
PIN 1. CATHODE 2. CATHODE 3. ANODE 1 2
3
MARKING DIAGRAM
XM X = Specific Device Code M = Date Code
* Low Clamping Voltage * Small Body Outline Dimensions: * * * * * *
0.039" x 0.024" (1.0 mm x 0.6 mm) Low Body Height: 0.016 (0.4 mm) Stand-off Voltage: 3.3 V - 5 V Low Leakage Response Time is Typically < 1 ns IEC61000-4-2 Level 4 ESD Protection These are Pb-Free Devices
SOT-1123 CASE 524AA
ORDERING INFORMATION
Device ESD11AxxDT5G Package SOT-1123 (Pb-Free) Shipping 8000/Tape & Reel
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating IEC 61000-4-2 (ESD) Contact PD Tstg TJ TL Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Storage Temperature Range Junction Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) Symbol Value 15 150 -55 to +150 -55 to +125 260 Unit kV mW C C C
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the table on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of ESD maximum ratings.
1 Publication Order Number: ESD11A3.3D/D
(c) Semiconductor Components Industries, LLC, 2009
October, 2009 - Rev. 1
ESD11A3.3DT5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Ppk C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Capacitance @VR = 0 and f = 1 MHz IPP VC VBR VRWM IR VF IT V IF I
Uni-Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
VRWM (V) Max 3.3 5.0 IR (mA) @ VRWM Max 1.0 0.1 VBR (V) @ IT (Note 2) Min 5.2 6.2 C (pF), uni-directional (Note 3) Typ 25 20 Max 35 30 VC (V) @ IPP = 1 A (Note 5) Max 7.8 9.5 VC (V) IEC61000-4-2 (Note 6) Typ Figures 1 thru 4 Figures 1 thru 4
Device ESD11A3.3DT5G ESD11A5.0DT5G
Device Marking 2* 3*
IT mA 1.0 1.0
*Rotated 90 clockwise. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 3. Uni-directional capacitance at f = 1 MHz, VR = 0 V, TA = 25C (pin1 to pin 3; pin 2 to pin 3). 4. Bi-directional capacitance at f = 1 MHz, VR = 0 V, TA = 25C (pin1 to pin 2). 5. Surge current waveform per Figure 7. 6. Typical waveform. For test procedure see Figures 5 and 6 and Application Note AND8307/D.
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ESD11A3.3DT5G SERIES
Figure 1. ESD11A3.3D Clamping Voltage Screenshot Positive 8 kV contact per IEC 61000-4-2
Figure 2. ESD11A3.3D Clamping Voltage Screenshot Negative 8 kV contact per IEC 61000-4-2
Figure 3. ESD11A5.0D Clamping Voltage Screenshot Positive 8 kV contact per IEC 61000-4-2
Figure 4. ESD11A5.0D Clamping Voltage Screenshot Negative 8 kV contact per IEC 61000-4-2
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ESD11A3.3DT5G SERIES
IEC 61000-4-2 Spec.
Test Voltage (kV) 2 4 6 8 First Peak Current (A) 7.5 15 22.5 30 Current at 30 ns (A) 4 8 12 16 Current at 60 ns (A) 2 4 6 8 I @ 60 ns 10% tP = 0.7 ns to 1 ns I @ 30 ns IEC61000-4-2 Waveform Ipeak 100% 90%
Level 1 2 3 4
Figure 5. IEC61000-4-2 Spec
ESD Gun
TVS
Oscilloscope
50 W Cable
50 W
Figure 6. Diagram of ESD Test Setup The following is taken from Application Note AND8308/D - Interpretation of Datasheet Parameters for ESD Devices. ESD Voltage Clamping
For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000-4-2 waveform. Since the IEC61000-4-2 was written as a pass/fail spec for larger
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 20 tP tr
systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D.
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
40 t, TIME (ms)
60
80
Figure 7. 8 X 20 ms Pulse Waveform
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ESD11A3.3DT5G SERIES
PACKAGE DIMENSIONS
SOT-1123 CASE 524AA-01 ISSUE B
b1
1 2
D
-X- -Y-
3
E b 0.08 (0.0032) X Y A
e
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b b1 c D E e HE L MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.22 0.28 0.10 0.15 0.20 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.35 0.40 --- 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.004 0.003 0.030 0.022 0.014 0.037 0.002 INCHES NOM 0.015 0.009 0.006 0.005 0.031 0.024 ---- 0.039 0.004 MAX 0.016 0.011 0.008 0.007 0.033 0.026 0.016 0.041 0.006
c
L HE
SOLDERING FOOTPRINT*
0.35 0.30
0.25 0.90 0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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ESD11A3.3D/D

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